This study was supported by grants from Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) and Fundação Carlos Chagas Filho de Amparo à Pesquisa do Estado do Rio de Janeiro (FAPERJ), Brazilian governmental institutions. The authors deny any conflicts of interest related to this study. “
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similar elastic modulus of fiber posts, resin cements, resin composite, and dentin is considered to be advantageous for improving the performance of restorations in endodontically treated teeth 1 and 2. In addition to the elastic modulus, the bond among the materials, as well as the bond of the materials to the dental substrate, may generate a homogeneous structure known as “monoblock” 3 and 4. A proper bonding at the dentin/cement, post/resin cement, and
post/composite interfaces is needed for dissipation of stresses generated by occlusal loads. Failure selleck kinase inhibitor related to any of these interfaces might impair the formation of the monoblock. Although the most frequent cause of failure in post-retained restorations is debonding at the cement/dentin interface 5 and 6, the interface between the cement/composite with the post also plays a role in the performance of the restoration. It has been suggested www.selleckchem.com/products/azd5363.html that resin cements bond to fiber posts via micromechanical and chemical mechanisms 7, 8, 9 and 10. The organic component of fiber posts is generally epoxy resin with a high degree of conversion and highly crosslinked (11). This polymer matrix is virtually unable to react with the monomers of resin cements. Silane coupling agents commonly used in dentistry react with the glass fibers and may not bond well to the organic component (12). Therefore, it has been suggested to treat the post in order to roughen the surface and expose the glass fibers, allowing micromechanical ASK1 interlocking of the adhesive/cement with the post (8). In addition, a chemical bonding may be established by using silane 12 and 13. Sandblasting and hydrofluoric acid etching are techniques used to improve the bonding of adhesive/cement to fiber
posts 9, 14 and 15. Because these techniques can sometimes damage the glass fibers and affect the integrity of the posts (9), substances that selectively dissolve the epoxy matrix without interfering with the fibers have been studied 10, 12, 13 and 16. Potassium permanganate, sodium ethoxide, and hydrogen peroxide (H2O2) may effectively remove the epoxy resin and expose the fibers, which are then available to be silanated 8, 10, 12 and 16. H2O2 at concentrations of 10% and 24% effectively removes the surface layer of the epoxy resin (13). However, application periods of 10 or 20 minutes used in previous studies are clinically impractical 13 and 17. Thus, the aim of this study was to evaluate the effect of higher concentrations of H2O2 and shorter application times on the bond strength between resin composite and glass fiber post.